FOSHAN DAFU NEW MATERIAL CO.,LTD

Liquid Crystal Polymer (LCP) Film
Liquid Crystal Polymer (LCP) Film
Material
LCP
Thickness
Length
Width
Certificate
ISO9001 ISO14001 SGS MSDS
Packing
MOQ

Features:

Low dielectric loss factor

Good processing performance

Homogeneous materials, the dielectric properties are very consistent

Low water absorption rate, the dielectric properties and dimensional stability is very good under humid conditions.


Application

Base material of  Flexible  Copper Clad Lamination (FCCL) used for high speed transmission flexible printed circuit board (FPC), 5G mobile phone antennas, camera soft boards, laptop high-speed transmission lines, smart watch antennas.




吸水率Water   absorption

传送损失Transmission loss

焊接耐热性Soldering heat resistance

加工性能

空气阻隔性Air barrier

室温Room   temperature

潮湿环境Humid environment

贴合Fit

钻孔Drilling

弯折Bending

LCP 膜 (film)

Ο

Ο

Ο

Ο

Ο

Ο

Ο

Ο

PI 薄膜 (film)

Ο

Ο

氟基薄膜Fluorine-based film

Ο

Ο

Ο

Ο

-

 Ο : Good performance. △ : Poor performance.

项目Item

单位Unit

方法Method

耐高温型    High temperature   resistant type

低熔点型 Low melting point type

拉伸强度Tensile Strength

MPa

ASTM D882

170

180

伸长率Elongation

%

30

35

拉伸模量Tensile modulus

MPa

3500

3000

熔点Melting   point

DSC

310

280

热膨胀系数Thermal expansion coefficient

ppm/℃

TMA

15

18

表面电阻率Surface resistivity

Ω

IEC62631-3-1/2

5E+16

4E+16

体积电阻率Volume resistivity

Ω·cm

2E+16

3E+16

击穿电压Breakdown voltage

KV/mm

IEC60243-1

200

200

吸湿性Hygroscopicity

%

ASTM D570

0.04

0.04

介电常数(DK)Dielectric constant ( DK )

-

ASTM D150

(25℃,28GHz,xy方向)

3.3

3.3

介质损耗因子Dielectric loss factor

-

0.002

0.002

可燃性Flammability

-

UL-94

V-0

V-0



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